Direct bonded copper(DBC)substrate,the most commonly used substrate in the power modules of electric vehicles for the thermal management,has reliability issues in high temperature cycle service condition due to significant thermally-induced stresses generated within DBC.Also,residual stresses are introduced during manufacturing.It is unknown if these stresses persist during thermal cycling or if they shake down during the first few cycles.A new type of electronic substrate(Al and Cu based) is under the investigation in this PhD project,in which neutron diffraction results will be used to examine the residual stresses and to validate FE modeling.In the experiment,Engin-X will map the residual stresses across the diffusion bonded Al-Cu interface.After mapping,samples will be shrouded in the heating blankets and put through a thermal excursion and data will be continuously collected.