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Anomalously low vacancy formation energies and migration barriers at Cu/AlN i...
It is well known that interfaces in nanomaterials can act as ultra-fast short-circuit diffusion paths, as originating from local structural, chemical and/or electronic... -
Explaining the effect of in-plane strain on thermal degradation kinetics of C...
Thermal annealing experiments evidence opposite effect on the degradation kinetics of Cu/W nano-multilayers from compressive to tensile in-plane strain. Besides higher...
